Method of reflow bonding electronic parts on printed circuit boa

Details Method of reflow bonding electronic parts on printed circuit boa Method of reflow bonding electronic parts on printed circuit boa

1987-01-16

1988-01-19

Godici, Nicholas P.

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281802, 228 10, 228 447, 228 45, 228 51, 219 85D, B23K 102, B23K 304, B23K 3514

Patent

active

047200359

ABSTRACT:
Reflow bonding of electronic parts such as large scale integrated circuits onto a printed circuit board, especially on multi-layer printed circuit board, requires that bonding tips press down the part leads with a uniform pressure and in a precise position on the printed circuit board for repeated operations. According to the present invention, the bonding tips providing a protrusion having an acute angle toward part leads, a first driving means for vertical movement of the bonding tips following a predetermined sequence, and a second driving means for opening and closing a gap between two bonding tips are provided in a reflow bonding apparatus. The method comprises steps of: (a) bonding tips are lowered on the printed circuit board, a contact position being taken as the reference position; (b) bonding tips are raised by a specified distance and the gap therebetween is closed, clipping part leads from both sides; (c) bonding tips are again lowered to a bonding position, pressing down part leads on the printed circuit board; and (d) reflow bonding by heating up the tip portion of bonding tips.

REFERENCES:
patent: 3382564 (1968-05-01), Gallantine
patent: 3895214 (1975-07-01), Winter
patent: 4034202 (1977-07-01), Vandermark
patent: 4500032 (1985-02-01), Ackerman
patent: 4654507 (1987-03-01), Hubbard et al.

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