Method of reducing voids in thermoset resin products

Details Method of reducing voids in thermoset resin products Method of reducing voids in thermoset resin products

1989-12-18

1991-09-03

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524141, 524127, 524139, 524711, 524128, 523515, C08K 500, C08K 552, C08L 6700

Patent

active

050455753

ABSTRACT:
A method of improving the flowability and reducing voids in liquid synthetic thermosetting resins precursor compositions used to pot structures such as a honeycomb core or electronic parts and assemblies. Up to about 0.50 weight percent of a suitable titanate coupling agent is mixed with the liquid resin precursor, preferably in a vacuum or an inert atmosphere, any necessary hardener is added later to the premixed resin with the agent, then the resin is poured into a mold holding the structure to be potted. The titanate coupling agents have the general formula: ##STR1## where: R is an alkoxy, alkyl, alkenyl, alkynyl or aralkyl group having from 1 to about 30 carbon atoms or a substituted derivative thereof;

REFERENCES:
patent: 4069192 (1978-01-01), Monte et al.
patent: 4087402 (1978-05-01), Monte et al.
patent: 4397751 (1983-08-01), Dickstein et al.

Affiliated with

Also associated with

Rating

Method of reducing voids in thermoset resin products does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of reducing voids in thermoset resin products, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing voids in thermoset resin products will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1009767