Method of reducing the formation of watermarks on semiconductor

Details Method of reducing the formation of watermarks on semiconductor Method of reducing the formation of watermarks on semiconductor

1997-06-25

2000-06-13

Bowers, Charles

Semiconductor device manufacturing: process

Gettering of substrate

By layers which are coated, contacted, or diffused

438143, 438471, 438906, 134 26, 134 38, 134 39, 134 42, H01L 21322, H01L 21335, H01L 218232, B08B 304

Patent

active

060749350

ABSTRACT:
A method for reducing the formation of watermarks includes providing a semiconductor wafer and contacting the semiconductor wafer with a solution containing a watermark reducing amount of at least one cationic surfactant.

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