Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2005-03-08
2005-03-08
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S747000, C134S001200, C134S001300
Reexamination Certificate
active
06864186
ABSTRACT:
A method and apparatus for reducing the contaminants in a wet etching bath by rapidly removing a substantial portion of the etching liquid from the bath such that the contaminants are removed from the air/liquid interface of the bath surface is described. By rapidly removing a substantial portion of the etching liquid from the bath, contaminants that are trapped by eddy currents and liquid/air surface tension forces are greatly reduced at the surface of the bath. The semiconductor wafers treated showed reduced levels of contamination.
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Dickstein , Shapiro, Morin & Oshinsky, LLP
Fourson George
Kebede Brook
Micro)n Technology, Inc.
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