Method of reducing pitch on semiconductor wafer

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C355S077000, C430S311000

Reexamination Certificate

active

06842222

ABSTRACT:
A projected image is formed during a material substrate. A photolithographic mask is illuminated with substantially coherent light at an oblique angle of incidence with respect to a surface of the photolithographic mask. The photolithographic mask includes a substantially transparent mask substrate and one or more lines and spaces patterns formed on the mask substrate and having a periodicity P. The mask substrate includes at least one phase shifting region. At least part of the light that is transmitted through the photolithographic mask is collected using one or more projection lenses which project the portion of the transmitted light onto the material substrate. The material substrate is disposed substantially parallel with, but at a distance from, a focal plane of the projection lens system. The phase shifting region of the mask substrate and the distance from the focal plane are selected such that a substantially focused image is projected onto the material substrate that includes the lines and spaces patterned but with a periodicity P/2.

REFERENCES:
patent: 5327515 (1994-07-01), Anderson et al.
patent: 5636004 (1997-06-01), Ootaka et al.
patent: 5703675 (1997-12-01), Hirukawa et al.
patent: 5903689 (1999-05-01), Painchaud et al.
patent: 6249335 (2001-06-01), Hirukawa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of reducing pitch on semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of reducing pitch on semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing pitch on semiconductor wafer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3432224

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.