Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1992-06-04
1994-01-11
Breneman, R. Bruce
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 3, 134 10, 134 41, B08B 700, C03C 2300
Patent
active
052777154
ABSTRACT:
Methods for reducing the number of adherent particulates in processing solutions to avoid deposition of such particulates onto a substrate treated with those processing solutions. For example, hydrogen fluoride-containing acids used to etch silicon dioxide layers during silicon wafer processing produce fluorosilicate particulates that tend to adhere to and contaminate the silicon substrate. Directing the processing solution carrying the fluorosilicate particulates to a filter employing silicon beads to remove the contaminant fluorosilicate particulates before they can recirculate and adhere to the silicon substrate.
REFERENCES:
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4752505 (1988-06-01), Arac
patent: 4778532 (1988-10-01), McConnell et al.
patent: 4899767 (1990-02-01), McConnell et al.
patent: 4917123 (1990-04-01), McConnell et al.
patent: 5051134 (1991-09-01), Schnegg et al.
Chiu H. Ting and M. Paunovic, "Selective Electroless Metal Deposition for Integrated Circuit Fabrication," J. Electrochem. Soc., vol. 136, No. 2, Feb. 1989, pp. 456-462.
C. H. Ting, M. Paunovic, P. L. Pai & G. Chiu, "Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection Structures" J. Electrochem. Soc., vol. 136, No. 2, Feb. 1989, pp. 462-466.
P. A. Dan, G. Popovici, D. Dascalu, Gh. Brezeanu & Al. Popa, "Structure of Chemically Deposited Ni/Si Contracts," J. Electrochem. Soc., vol. 130, No. 12, Dec. 1983, pp. 2472-2478.
Miles V. Sullivan & John H. Eigler, "Electroless Nickel Plating for Making Ohmic Contracts to Silicon," J. Electrochem. Soc., vol. 104, No. 4, Apr. 1957, pp. 226-230.
Breneman R. Bruce
El-Arini Zeinab
Micron Semiconductor Inc.
LandOfFree
Method of reducing particulate concentration in process fluids does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of reducing particulate concentration in process fluids, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing particulate concentration in process fluids will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1628380