Method of reducing non-uniformities during chemical...

Details Method of reducing non-uniformities during chemical... Method of reducing non-uniformities during chemical...

2007-10-03

2011-10-18

Olsen, Allan (Department: 1716)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C257SE21214, C257SE21304

Reexamination Certificate

active

08039398

ABSTRACT:
Prior to performing a CMP process for planarizing a metallization level of an advanced semiconductor device, an appropriate cap layer may be formed in order to delay the exposure of metal areas of reduced height level to the highly chemically reactive slurry material. Consequently, metal of increased height level may be polished with a high removal rate due to the mechanical and the chemical action of the slurry material, while the chemical interaction with the slurry material may be substantially avoided in areas of reduced height level. Therefore, a high process uniformity may be achieved even for pronounced initial surface topographies and slurry materials having a component of high chemical reactivity.

REFERENCES:
patent: 5395801 (1995-03-01), Doan et al.
patent: 5721172 (1998-02-01), Jang et al.
patent: 5827782 (1998-10-01), Shih
patent: 5840629 (1998-11-01), Carpio
patent: 5847461 (1998-12-01), Xu et al.
patent: 5920792 (1999-07-01), Lin
patent: 6004873 (1999-12-01), Jang et al.
patent: 6051496 (2000-04-01), Jang
patent: 6096652 (2000-08-01), Watts et al.
patent: 6114234 (2000-09-01), Merchant et al.
patent: 6114246 (2000-09-01), Weling
patent: 6169028 (2001-01-01), Wang et al.
patent: 6242805 (2001-06-01), Weling
patent: 6258711 (2001-07-01), Laursen
patent: 6287970 (2001-09-01), Merchant et al.
patent: 6291367 (2001-09-01), Kelkar
patent: 6300653 (2001-10-01), Pan
patent: 6391707 (2002-05-01), Dirnecker et al.
patent: 6391780 (2002-05-01), Shih et al.
patent: 6646323 (2003-11-01), Dirnecker et al.
patent: 7605082 (2009-10-01), Reid et al.
patent: 7811925 (2010-10-01), Reid et al.
patent: 2002/0096770 (2002-07-01), Mukherjee et al.
patent: 2002/0163029 (2002-11-01), Dirnecker et al.
patent: 2002/0182886 (2002-12-01), Spinner, III et al.
patent: 2003/0054649 (2003-03-01), Wu et al.
patent: 2003/0203624 (2003-10-01), Sameshima et al.
patent: 2004/0266188 (2004-12-01), Kondo et al.
patent: 2006/0003570 (2006-01-01), Shanmugasundram et al.
patent: 2006/0042502 (2006-03-01), Sato et al.
patent: 2006/0054962 (2006-03-01), Dunton et al.
patent: 2006/0163083 (2006-07-01), Andricacos et al.
patent: 2009/0045164 (2009-02-01), Farkas et al.
patent: 2010/0051474 (2010-03-01), Andricacos et al.
patent: 2010/0093168 (2010-04-01), Naik
patent: WO 01/21724 (2001-03-01), None
Translation of Official Communication from German Patent Office for German Patent Application No. 10 2007 009 902.0-43 dated Oct. 16, 2007.

Affiliated with

Also associated with

Rating

Method of reducing non-uniformities during chemical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of reducing non-uniformities during chemical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing non-uniformities during chemical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4254501