Method of reducing moisture content of hermetic packages contain

Package making – Methods – With contents treating

Patent

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Details

53440, 53472, 2521811, B65B 2500, B65B 3102

Patent

active

051952998

ABSTRACT:
Described is a method of reducing the moisture content in a hermetic package containing a semiconductor device by including a small amount of cyanate ester within the package.

REFERENCES:
patent: 1743167 (1930-01-01), Styer
patent: 2895270 (1959-07-01), Blaess
patent: 3586926 (1971-06-01), Nakamura et al.
patent: 4280885 (1981-07-01), Savery
patent: 4375498 (1983-03-01), Le Minez et al.
patent: 5114003 (1992-05-01), Jackisch et al.

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