Method of reducing laser mark peeling

Details Method of reducing laser mark peeling Method of reducing laser mark peeling

1998-10-28

2000-01-25

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

430 22, G03F 900

Patent

active

060176628

ABSTRACT:
A method of reducing laser mark peeling depends on what sort of layer lies over the laser mark. If a structure formed on the laser mark is a conductive layer, an adhesion layer or a passivation layer, the conductive layer, adhesion layer or passivation layer is removed from the laser mark. If a structure formed on a laser mark is a dielectric layer, the dielectric layer is left on the laser mark. The area removed from the upper layer is equal to or bigger than the area removed from the lower layer in order to avoid contacts between the conductive layers. In addition to being used for a laser mark, the method mentioned above can be also used for a wafer edge and an alignment mark.

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