Method of reducing emitter dip in transistors utilizing specific

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29578, 148187, 148190, 357 34, 357 63, 357 88, 357 90, H01L 21225, H01L 2936

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042266505

ABSTRACT:
A semiconductor device comprising an N type collector layer formed in an N type semiconductor wafer, a P type base layer which is in contact with the N type collector layer at a PN junction that extends to the surface and which contains an N type impurity material of which the energy of combination with vacancies is great and boron which is a P type impurity material, and an N type emitter layer which is so formed as to be surrounded by this P type base layer and forms a transistor together with the N type collector layer and the P type base layer and which contains the N type impurity materials phosphorus and arsenic. Arsenic or antimony or the like, which are N type impurity materials of which the energy of combination with vacancies is great are diffused in the P type base layer.

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Fair et al., "Effect of Complex . . . Arsenic in Silicon", J. Appl. Physics, vol. 44, No. 1, Jan. 1973, pp. 273-279.
Fair, R. B., "Quantitative Theory . . . Arsenic Emitters", Ibid., vol. 44, No. 1, Jan. 1973, pp. 283-291.
Saraswat et al., "A New Bipolar Process--Borsenic", IEEE J. Solid-State Circuits, vol. SC-11, No. 4, Aug. 1976, pp. 495-500.
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