Method of reducing defectivity during chemical mechanical...

Details Method of reducing defectivity during chemical mechanical... Method of reducing defectivity during chemical mechanical...

2005-01-18

2005-01-18

Nguyen, Dung Van (Department: 3723)

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C451S398000

Reexamination Certificate

active

06843708

ABSTRACT:
A method of reducing defectivity during chemical mechanical planarization (CMP) in a system having a wafer membrane and a retaining ring is disclosed. The method includes planarizing test wafers using different values of ring pressure and wafer pressure to determine an optimum ring pressure and wafer pressure, i.e., the ring pressure and wafer pressure that results in a reduced defectivity.

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patent: 6439964 (2002-08-01), Prahbu et al.
patent: 6602436 (2003-08-01), Mandigo et al.

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