Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-11-02
1994-04-26
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156250, 156280, 427238, 427295, 427156, 427293, 4273742, 437227, B32B 3100
Patent
active
053063708
ABSTRACT:
A method of fabricating thermal ink jet printheads comprises aligning and bonding a pair of silicon wafers together, which have, on opposing confronting surface thereof, a plurality of sets of linear arrays of heating elements and associated driver circuitry on one wafer surface and a plurality of sets of parallel grooves and a communicating reservoir for each set of grooves. The grooves and reservoirs are filled with a filler material which is solid or gels at room temperature and liquid at higher temperatures. The bonded pair of wafers are severed into a plurality of individual printhead sby dicing processes conducted at room temperature. One of the dicing processes cuts the grooves in a direction perpendicular thereto in order to form concurrently the nozzle face and nozzles. The solid filler material supports fragile edges of the wafers and prevents entry of dicing debris and other contaminants. The printheads are subjected to heat, spinning, and high pressure water spray to remove the filler material.
REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 2711969 (1955-06-01), Abig
patent: 3775215 (1973-11-01), Fasching
patent: 3816158 (1974-06-01), Jacobs
patent: 3948701 (1976-04-01), Fasbender
patent: 3970494 (1976-07-01), Pritchard
patent: 4133920 (1979-01-01), Schulthess
patent: 4339295 (1982-07-01), Boretos
patent: 4469649 (1984-09-01), Ibaz
patent: 4473424 (1984-09-01), Sorko-Ram
patent: 4479986 (1984-10-01), Juday
patent: 4606962 (1986-08-01), Reylek
patent: 4638337 (1987-01-01), Torpey et al.
patent: 4678529 (1987-07-01), Drake et al.
patent: 4715917 (1987-12-01), Tirelli
patent: 4720317 (1988-01-01), Kuroda
patent: 4755396 (1988-07-01), Geisler
patent: 4774530 (1988-09-01), Hawkins
patent: 4878992 (1989-11-01), Campanelli
patent: 4897141 (1990-01-01), Girard
patent: 4956037 (1990-09-01), Vivaldi
patent: 5133995 (1992-07-01), Do
patent: 5152857 (1992-10-01), Ito
Altavela Robert P.
Herko Lawrence H.
Wallace Kathryn A.
Weber Joseph R.
White Robert M.
Chittum Robert A.
De Simone Mark
Simmons David A.
Xerox Corporation
LandOfFree
Method of reducing chipping and contamination of reservoirs and does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of reducing chipping and contamination of reservoirs and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing chipping and contamination of reservoirs and will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1709687