Method of recovering valuables from printed wiring board having

Details Method of recovering valuables from printed wiring board having Method of recovering valuables from printed wiring board having

1996-05-17

1998-04-28

Andrews, Melvyn

Specialized metallurgical processes, compositions for use therei

Processes

Producing or treating free metal

294264, 294265, C22B 300

Patent

active

057439362

ABSTRACT:
The method of recovering valuables from a printed wiring board on which electronic components are mounted, includes the steps of (a) removing electronic components from a printed wiring board on which the electronic components are mounted, (b) polishing a surface of the printed wiring board from which the electronic components have been removed in the step (a), (c) milling the printed wiring board a surface of which has been polished in the step (b), and (d) separating milled portions of the printed wiring board into portions mainly including copper and portions mainly including resin and filler. The electronic components recovered in accordance with the method includes valuables such as gold having greater grade than natural minerals. The copper recovered in accordance with the method includes no impurities such as solder, and thus can be reclaimed as metal resource having high added value. The residual glass fiber and resin scarcely includes impurities such as solder, and thus can be reused as a filler to be used for building materials and construction materials.

REFERENCES:
patent: 5375318 (1994-12-01), Catalano
patent: 5456738 (1995-10-01), Gil
patent: 5547134 (1996-08-01), Rubenstein
Ibold, et al., "Stand und Moglichkeiten des Electronikschrott-Recycling", Erzmetall 47 (1994) Nr. 9, pp. 554-561.
Klaus Feldmann et al., "Disassembly of electronic products", Institute of Electrical and Electronics Engineers, Inc., 94CH3386-9, May, 1993, pp. 81-86.

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