Method of recording test results of die on a wafer

Details Method of recording test results of die on a wafer Method of recording test results of die on a wafer

1988-12-05

1990-05-22

Pitts, Harold I.

Registers

Coded record sensors

Feed mechanisms

235454, 235383, G06K 1304

Patent

active

049280023

ABSTRACT:
A method which eliminates ink marking of die on a wafer uses a printer to print information of the test results in a digitally formatted manner. This information, preferably on a piece of paper, is then transferred with the wafer to a die bonder which selects the good die to be further processed.

REFERENCES:
patent: 4570058 (1986-02-01), Hauassy

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