Method of receiving small-sized electronic parts

Details Method of receiving small-sized electronic parts Method of receiving small-sized electronic parts

1986-04-17

1987-10-27

Woo, Jay H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156257, 156268, 156291, 156293, 156324, 156344, 206330, 206332, 428 40, 428138, B32B 3100

Patent

active

047027886

ABSTRACT:
A number of holes for individually receiving small-sized electronic parts such as chip capacitors and ceramic capacitors are formed in a strip of carrier tape to preserve these parts. The carrier tape is made of a strip of base material and a strip of double-sided adhesive tape stuck on one surface of the base material such that the area of each portion of the adhesive layer exposed through the holes is smaller than the area of each hole. The base material is made of an electrically conductive material. Alternatively, the base material may be made of nonconductive material and the surface may be treated so as to be electrically conductive. Incisions are formed in the adhesive layer to facilitate removal of the adhesive in withdrawing the electronic parts from the tape. When the electronic parts are inserted in the holes, they are stuck on the adhesive layer, and then the tape is wound on a reel for storgage.

REFERENCES:
patent: 3623924 (1971-11-01), De Winter
patent: 3918988 (1975-11-01), Abens
patent: 3953274 (1976-04-01), Winrow et al.
patent: 4298120 (1981-11-01), Kaneko et al.
patent: 4302492 (1981-11-01), Hutter, III
patent: 4406367 (1983-09-01), Bouwknegt

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