Method of raising the breakdown voltage of an integrated capacit

Details Method of raising the breakdown voltage of an integrated capacit Method of raising the breakdown voltage of an integrated capacit

1982-06-24

1984-10-02

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

357 55, 427 79, 427 96, 204 38A, 156657, 361275, 361304, H01L 2900, H01L 21441, H01L 21465

Patent

active

044751206

ABSTRACT:
The invention relates to a method suitable for raising the breakdown voltage of a capacitor of the integrated circuit type formed on a semiconductor substrate and characterized in that the lower plate of the capacitor is under etched so that an air wedge is obtained. As a result of the air wedge, the electric current passed through the semiconductor material is lengthened and the breakdown phenomena at the edges of the capacitor are reduced. The invention also relates to capacitors obtained in this manner.

REFERENCES:
patent: 3466719 (1969-09-01), Sharif et al.
patent: 3619387 (1971-11-01), Mindt et al.
patent: 3679942 (1972-07-01), Daly
patent: 3714529 (1973-01-01), Cowpland et al.

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