Method of qualifying a process tool with wafer defect maps

Details Method of qualifying a process tool with wafer defect maps Method of qualifying a process tool with wafer defect maps

2006-07-18

2006-07-18

Barlow, John (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

Reexamination Certificate

active

07079966

ABSTRACT:
A method of qualifying a process tool includes steps of: (a) finding a plurality of pre-scan defect locations on a surface of a semiconductor wafer; (b) subjecting the semiconductor wafer to processing by the process tool; (c) finding a plurality of post-scan defect locations on the surface of the semiconductor wafer; and (d) calculating a plurality of defect locations added by the process tool from the pre-scan defect locations and the post-scan defect locations.

REFERENCES:
patent: 5870187 (1999-02-01), Uritsky et al.
patent: 6701259 (2004-03-01), Dor et al.

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