Method of proximity imaging photolithographic structures for ink

Details Method of proximity imaging photolithographic structures for ink Method of proximity imaging photolithographic structures for ink

1992-05-29

1994-05-10

Wintercorn, Richard A.

Photocopying

Contact printing

Frames

346140R, G03B 2728, G01D 1516, G01D 1518

Patent

active

053112520

ABSTRACT:
A method of proximity imaging photolithographic structures for the fabrication of high resolution ink jet orifice plates is used in ink jet printers. The method comprises the step of providing a positive-acting photoresist coating onto an electrically conducting plating substrate. A clear glass photomask is brought into planar proximity and a planar gap is established by means of screen shims permanently bonded to the glass photomask. It is desirable to ensure that the shims are uniformly distributed about the mask with at least one shim in the center. An atmospheric pressure sufficient to ensure that the shims are settled against the resist-coated substrate is then applied, before exposing the surface with an ultraviolet light source and developing to produce a non-conductive peg pattern corresponding to the desired orifice pattern.

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Commonly assigned U.S. Ser. No. 732,281.

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