Method of providing uniform photoresist coatings for tight contr

Coating processes – Centrifugal force utilized

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427314, 4274071, 427337, 427384, 438761, 438782, B05D 312, B05D 302, H01L 2131

Patent

active

059853638

ABSTRACT:
A method for providing a uniform coating of photoresist over substrate for defining high density integrated device and circuit patterns. This is accomplished by applying the photoresist onto the substrate in multiple, separate dispensing steps and leveling spins to attain the designed thickness uniformly over substrate having high topographic surfaces, thereby preserve the integrity of the critical dimension for multi-level alignments used in the fabrication of integrated devices and circuits.

REFERENCES:
patent: 4022927 (1977-05-01), Pfeiffer et al.
patent: 4113492 (1978-09-01), Sato et al.
patent: 4267212 (1981-05-01), Sakawaki
patent: 4741926 (1988-05-01), White et al.
patent: 4748053 (1988-05-01), Okada
patent: 4850381 (1989-07-01), Moe et al.
patent: 4886728 (1989-12-01), Salamy et al.
patent: 5066616 (1991-11-01), Gordon
patent: 5122439 (1992-06-01), Miersch et al.
patent: 5344748 (1994-09-01), Feely
patent: 5346799 (1994-09-01), Jeffries, III et al.
patent: 5395803 (1995-03-01), Adams
patent: 5405813 (1995-04-01), Rodriques
patent: 5444921 (1995-08-01), Milina
patent: 5608943 (1997-03-01), Konishi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of providing uniform photoresist coatings for tight contr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of providing uniform photoresist coatings for tight contr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing uniform photoresist coatings for tight contr will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1321207

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.