Method of providing sub-floor with decorative floor panels

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156152, 156247, 156272, 156320, 156344, 156499, 156574, 156584, B32B 3104, C09J 506

Patent

active

042216206

ABSTRACT:
A method of laying large surfacing and/or decorative floor panels or sheets upon a sub-floor with hot melt adhesives which have no solvents but are activated by heat and bond immediately upon loss of heat to a predetermined level, which method provides steps of running an adhesive undercoated 4.times. 8 foot sheet, for example, over a low profile heater on the sub-floor, and pressing the sheet to a preselected desired position on the sub-floor before the adhesive cools to mechanical bonding temperature and including removal of damaged or mislaid sheets by inverting the heater and running over the exposed sheet surface to heat the underlying adhesive to an elevated release temperature so manual lifting can remove the sheet without damage to the sub-floor.

REFERENCES:
patent: 2084625 (1937-06-01), Stebbins et al.
patent: 2655976 (1953-10-01), Lovin
patent: 2709742 (1955-05-01), Perry
patent: 3348641 (1967-10-01), Gage
patent: 3733231 (1973-05-01), Rutkowski et al.
patent: 3976533 (1976-08-01), Strauven

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