Method of providing resin free surfaces adjacent a bonded joint

Details Method of providing resin free surfaces adjacent a bonded joint Method of providing resin free surfaces adjacent a bonded joint

1987-09-25

1988-10-11

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156252, 1562728, 156285, 156286, 156289, 156295, 264102, 264510, B32B 3120

Patent

active

047769076

ABSTRACT:
A method of resin bonding opposing surfaces of a pair of members for providing a joint having substantially resin free surfaces adjacent the joint. The adjacent surfaces and the joint are covered in intimate contact with a thin, perforated, flexible, and nonadherent film for perforating resin extruded from the joint during application of bonding pressure. The nonadherent film is covered with a sheet of flexible absorbent material for absorbing the resin perforated through perforations along the film. Bonding pressure is applied to the joint to extrude the resin from the joint. The nonadherent film and the absorbent sheet is then removed from the surfaces adjacent to the joint to facilitate secondary bonding to the adjacent surfaces.

REFERENCES:
patent: 3666600 (1972-05-01), Yoshino
patent: 3703422 (1972-11-01), Yoshino
patent: 3706621 (1972-12-01), Lichtman
patent: 4311661 (1982-01-01), Palmer
patent: 4504341 (1985-03-01), Radzwill et al.

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