Method of providing raised electrical contacts on electronic mic

Metal fusion bonding – Process – With shaping

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228179, H01L 21441

Patent

active

044429673

ABSTRACT:
A method of providing a raised contact portion on a contact area of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area. A weakening is created in the wire near the ball and the wire is then severed at the area of the weakening to provide the desired raised contact portion.

REFERENCES:
patent: 3357090 (1967-12-01), Tiffany
patent: 3430835 (1969-03-01), Grable
patent: 4219143 (1980-08-01), Gailland

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