Method of providing moisture-free enclosure for electronic devic

Coating processes – Vacuum utilized prior to or during coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4273722, 427386, 427387, 4273977, 4273978, B05D 300

Patent

active

054015367

ABSTRACT:
A method of making a sealed enclosure for an electronic device utilizes a coating or adhesive with desiccant properties. The coating or adhesive comprises a protonated alumino silicate powder dispersed in a polymer.

REFERENCES:
patent: 4633032 (1986-12-01), Oido et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of providing moisture-free enclosure for electronic devic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of providing moisture-free enclosure for electronic devic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing moisture-free enclosure for electronic devic will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2249016

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.