Method of providing metal bumps on an apertured substrate

Details Method of providing metal bumps on an apertured substrate Method of providing metal bumps on an apertured substrate

1978-09-11

1980-12-09

Tolin, Gerald P.

Coating processes

Electrical product produced

Welding electrode

174 685, 427 97, 361400, H05K 310

Patent

active

042385270

ABSTRACT:
Method of providing metal bumps on an apertured substrate and substrate having metal bumps.

REFERENCES:
patent: 3700538 (1972-10-01), Kennedy
patent: 3786172 (1974-01-01), Cowley
patent: 3832769 (1974-09-01), Olyphant, Jr.
patent: 4118523 (1978-10-01), Bingham

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