Method of providing low cost heat sink

Details Method of providing low cost heat sink Method of providing low cost heat sink

1993-05-20

1995-03-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

437217, 437219, 437902, H01R 4300

Patent

active

053946073

ABSTRACT:
The invention disclosed herein is a device and method in which a heat sink (22) is attached to support leads (18) of a leadframe (10) via a welding or mechanical joining technique. The method is performed prior to semiconductor device packaging and is usually performed after the leadframe is etched or stamped, and before it is cut into strips.

REFERENCES:
patent: 3560808 (1971-02-01), Segerson
patent: 3930114 (1975-12-01), Hodge
patent: 4012765 (1977-03-01), Lehner et al.
patent: 4530003 (1985-07-01), Blair et al.
patent: 4611389 (1986-09-01), Blair et al.
patent: 4649637 (1987-03-01), Hatakeyama
patent: 5202288 (1993-04-01), Doering et al.

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