Method of providing electrical separation in integrated...

Details Method of providing electrical separation in integrated... Method of providing electrical separation in integrated...

2011-01-11

2011-01-11

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S024000, C438S046000

Reexamination Certificate

active

07867792

ABSTRACT:
An integrated device includes two sections (A, B), such as a DFB laser (A) and an EAM modulator (B), having a semi-insulating (SI) separation region therebetween. The separation region (24) is of a material acting as a trap on electrons and configured to impede current flow between the two sections (A, B) due to holes. The separation region (24) may be of a material acting as a trap both on electrons and holes. Alternatively, the separation region (24) is of a material that acts as a trap on electrons and is provided over a p-type substrate (20) common to the two sections (A, B).

REFERENCES:
patent: 5684307 (1997-11-01), Ishimura
patent: 5783844 (1998-07-01), Kobayashi et al.
patent: 6692837 (2004-02-01), Iga et al.
patent: 2002/0105992 (2002-08-01), Arakawa et al.
patent: 2004/0048406 (2004-03-01), Ikeda et al.
patent: 2005/0036729 (2005-02-01), Kim et al.
patent: 61/290790 (1986-12-01), None
patent: 62/213131 (1987-09-01), None
Aoki, et al., “High Performance Modulator/Integrated Light Sources Grown by an In-Plane Bandgap Energy-Control Technique”,OFC '95 Optical Fiber Communication, Summaries of Papers, Optical Society of America(1995), vol. 8, pp. 25-26.

Affiliated with

Also associated with

Rating

Method of providing electrical separation in integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of providing electrical separation in integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing electrical separation in integrated... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2707775