Method of providing electrical contact to component leads

Details Method of providing electrical contact to component leads Method of providing electrical contact to component leads

1997-08-28

1999-02-23

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438123, 257692, H01L 2144, H01L 2148, H01L 2150

Patent

active

058743235

ABSTRACT:
A method of providing electrical contact between an external contact element and an electrical lead of a component includes the act of inserting the electrical component into a carrier socket having a housing and a cavity within the housing for receiving the electrical component. The method further includes electrically connecting the electrical lead and a first electrically conductive member, wherein the first conductive member includes a portion which extends into the cavity so as to make electrical contact with the electrical lead; securing the electrical component within the cavity; and electrically connecting the first conductive member to a second electrically conductive member, wherein the second conductive member includes a portion which extends outwardly from the housing so as to make electrical contact with the external contact element.

REFERENCES:
patent: 4089575 (1978-05-01), Grabbe
patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4222622 (1980-09-01), Griffin et al.
patent: 4941832 (1990-07-01), Korsunsky et al.
patent: 4959029 (1990-09-01), Grabbe
patent: 4995816 (1991-02-01), Grabbe
patent: 5007844 (1991-04-01), Mason et al.
patent: 5055972 (1991-10-01), Atoh
patent: 5177671 (1993-01-01), Atoh
patent: 5249971 (1993-10-01), Lai et al.

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