Method of providing conductive tracks on a printed circuit...

Details Method of providing conductive tracks on a printed circuit... Method of providing conductive tracks on a printed circuit...

2005-09-27

2005-09-27

Bell, Bruce F. (Department: 1746)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S279000, C204S281000, C204S206000

Reexamination Certificate

active

06949171

ABSTRACT:
This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to form a second electrode of the electro-plating circuit therewith.

REFERENCES:
patent: 2744859 (1956-05-01), Rines
patent: 3506545 (1970-04-01), Garwin et al.
patent: 3755089 (1973-08-01), Rapids
patent: 4159934 (1979-07-01), Kadija
patent: 4220504 (1980-09-01), Hanley et al.
patent: 4270986 (1981-06-01), Smith
patent: 4304654 (1981-12-01), Norris
patent: 4385968 (1983-05-01), Gaston
patent: 4481081 (1984-11-01), Doubt
patent: 4564430 (1986-01-01), Bacon et al.
patent: 4592808 (1986-06-01), Doubt
patent: 4595464 (1986-06-01), Bacon et al.
patent: 4655881 (1987-04-01), Tezuka et al.
patent: 4786389 (1988-11-01), Moffitt
patent: 4800001 (1989-01-01), Ott et al.
patent: 4911796 (1990-03-01), Reed
patent: 4952296 (1990-08-01), Wingenfeld et al.
patent: 5002649 (1991-03-01), Smith
patent: 5024735 (1991-06-01), Kajida
patent: 5401369 (1995-03-01), Gershin
patent: 5409593 (1995-04-01), Moskowitz
patent: 5599595 (1997-02-01), McGinley et al.
patent: 5688146 (1997-11-01), McGinley et al.
patent: 5713233 (1998-02-01), McCarthy et al.
patent: 5985107 (1999-11-01), McLaughlin
patent: 934 620 (1955-10-01), None
patent: DT 20 636 32 (1971-07-01), None
patent: 36 03 856 (1987-08-01), None
patent: 00 491 92 (1982-04-01), None
patent: DE 37 30 740 (1992-03-01), None
patent: 25 333 56 (1984-03-01), None
patent: 25 334 29 (1984-03-01), None
patent: 25 740 95 (1986-06-01), None
patent: 26 931 29 (1994-01-01), None
patent: 27 140 80 (1996-06-01), None
patent: 21 760 36 (2000-01-01), None
patent: 574 946 (1946-01-01), None
patent: 1 077 867 (1967-08-01), None
patent: 1 175 613 (1969-12-01), None
patent: 1 556 226 (1979-11-01), None
patent: 20 606 99 (1981-05-01), None
patent: 2 192 642 (1988-01-01), None
patent: 2 234 525 (1991-02-01), None
patent: 56142698 (1981-11-01), None
patent: 62 124 89 (1987-06-01), None
patent: 82 960 84 (1996-11-01), None
patent: 487164 (1975-10-01), None
patent: WO 79/00608 (1979-08-01), None
patent: WO 91/09511 (1991-06-01), None
patent: WO 97/36464 (1997-10-01), None
DALIC Metallisation Electrochimique Selective Plating http://www.dalicworld.com/histogb.htn Mar. 30, 1998.
DALIC Metallisation Electrochimique Selective Plating http://www.dalicworld.com/grgb.htn Mar. 30, 1998.
SIFCO What is Brush Plating http://www.sifco-sp.com/applications.htn Mar. 30, 1998.
Brooktronics Engineering Corporation—What is Brush Plating http://www.brooktronics.com/whatsbp.h Mar. 30, 1998.
Reference Manual on the Installation and Adjustment of Radio-Electronic Apparatus, I.M. Zarkh, Lenizdat 1965 (w/English translation).

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