Radiation imagery chemistry: process – composition – or product th – Effecting frontal radiation modification during exposure,...
Patent
1978-03-13
1980-05-06
Kimlin, Edward C.
Radiation imagery chemistry: process, composition, or product th
Effecting frontal radiation modification during exposure,...
156 74, 1566591, 264241, 264311, 355 91, 355132, 427240, 430494, 430306, 430323, 430444, G03C 506, G03C 504
Patent
active
042015812
ABSTRACT:
In certain types of printing applications (for example optical or magnetic contact printing) wherein it is desired to transfer imagery from a master device to a replicate device, providing and maintaining close contact between the master device and the replicate device poses certain problems. These problems become even more acute if the surfaces to be contacted are of large area. In accordance with the present invention, close contact over even large areas is obtained between a master device and a replicate device by forming a thin and uniform liquid layer between the master and replicate devices, thus producing a vacuum effect which serves to tightly press the master and replicate devices together.
REFERENCES:
patent: 2833680 (1958-05-01), Kneeling
patent: 3537853 (1970-11-01), Wessells et al.
patent: 3723120 (1973-03-01), Hummel
patent: 3751250 (1973-08-01), Moscony et al.
patent: 3922086 (1975-11-01), Freericks
patent: 4069076 (1978-01-01), Fickes
Haininl et al., "Liquid Interface for Photoresist", IBM Tech. Disc. Bull., vol. 14, No. 9, Feb. 1972.
Howe Dennis G.
Lee James K.
Thomas Harold T.
Eastman Kodak Company
Kimlin Edward C.
Strickland Donald W.
LandOfFree
Method of providing close contact for contact printing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of providing close contact for contact printing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing close contact for contact printing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1003380