Method of providing a semiconductor body on a support

Details Method of providing a semiconductor body on a support Method of providing a semiconductor body on a support

1989-03-21

1990-10-09

Heinrich, Sam

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228208, 228254, 228261, 22826312, 22826317, 437222, B23K10310, H01L 2148, H01L 2158, H01L 21603

Patent

active

049615289

ABSTRACT:
The invention relates to a method of providing a semiconductor body on a support with the interposition of a metal layer of aluminum. The adherence is effected in that the semiconductor body and the support are pressed against each other during the supply of heat at the area of the metal layer. The metal layer of aluminum is first applied to the support by flame spraying.

REFERENCES:
patent: 3872577 (1975-03-01), Kugler et al.
patent: 3896542 (1975-07-01), Dale
patent: 4286743 (1981-09-01), Vasseur et al.
patent: 4448853 (1984-05-01), Fischer et al.
patent: 4542401 (1985-09-01), Sekiba
patent: 4729504 (1988-03-01), Edamura
patent: 4757934 (1988-07-01), Greenstein
patent: 4817853 (1989-04-01), Scanlon
patent: 4905886 (1990-03-01), Kennedy et al.

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