Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-01-12
2009-10-06
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S829000, C029S854000, C029S832000, C439S637000, C439S067000, C439S065000, C439S077000, C439S060000, C174S254000, C174S257000, C174S258000, C174S264000
Reexamination Certificate
active
07596863
ABSTRACT:
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination, the cover members for a seal and prevent dielectric material (e.g., resin) liquefied during the lamination from contacting the conductive layers on the opposed surfaces of the inner (first) substrate. A PCB is thus formed with either a projecting edge portion or a plurality of cavities therein such that electrical connection may be made to the PCB using an edge connector or the like.
REFERENCES:
patent: 4026627 (1977-05-01), Benasutti
patent: 4872851 (1989-10-01), Babuka et al.
patent: 5309629 (1994-05-01), Traskos et al.
patent: 5939789 (1999-08-01), Kawai et al.
patent: 6109939 (2000-08-01), Kondo et al.
patent: 6634561 (2003-10-01), Wallace
patent: 6688897 (2004-02-01), Korsunsky et al.
patent: 6818168 (2004-11-01), Morales
patent: 6899546 (2005-05-01), Longueville et al.
patent: 6966482 (2005-11-01), Totani et al.
patent: 6986917 (2006-01-01), Takada et al.
patent: 7036214 (2006-05-01), Kondo et al.
patent: 7048547 (2006-05-01), Gottwald
patent: 7084355 (2006-08-01), Kosaka et al.
patent: 7147480 (2006-12-01), Ikeda
Bhatt Ashwinkumar C.
Harendza Robert J.
Japp Robert M.
Banks Derris H
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell
Le Dan D
LandOfFree
Method of providing a printed circuit board with an edge... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of providing a printed circuit board with an edge..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing a printed circuit board with an edge... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4103880