Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-07-03
2007-07-03
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C219S121180, C219S121190
Reexamination Certificate
active
11207330
ABSTRACT:
A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable film on the via-defining substrate; and providing interconnects on the via-defining substrate. Providing interconnects comprises providing a patterned build-up layer on the via-defining substrate comprising exposing the laser activatable film to laser irradiation to selectively activate portions of the film according to a predetermined interconnect pattern; and metallizing the patterned build-up layer according to the predetermined interconnect pattern to yield the interconnects to provide the printed circuit board.
REFERENCES:
patent: 5233133 (1993-08-01), Iwasaki et al.
patent: 2001/0029065 (2001-10-01), Fischer et al.
patent: 2001/0036721 (2001-11-01), Dallner et al.
patent: 2004/0134682 (2004-07-01), En et al.
Arbes Carl J.
Intel Corporation
Jalali Laleh
LandOfFree
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