Method of providing a planarized polymer coating on a substrate

Details Method of providing a planarized polymer coating on a substrate Method of providing a planarized polymer coating on a substrate

1986-11-13

1988-12-27

Beck, Shrive

Coating processes

Centrifugal force utilized

427384, 430330, B05D 312

Patent

active

047940212

ABSTRACT:
Applying a photoresist layer containing a solvent to the top of an electronic wafer by spin coating. Before the layer dries the wafer is heated in an oven while controlling the solvent loss from the coating by maintaining the pressure of the solvent vapor and providing a slow solvent loss for planarizing the top surface of the polymer. The device is removed from the first oven and the bake cycle is completed in a standard convection bake oven.

REFERENCES:
patent: 569160 (1896-10-01), Ball
patent: 4068019 (1978-01-01), Bueckl
patent: 4113492 (1978-09-01), Sato
patent: 4347302 (1982-08-01), Gotman
patent: 4468411 (1984-08-01), Sloan
patent: 4510176 (1985-04-01), Cuthbert
patent: 4518828 (1985-05-01), Economy
patent: 4562100 (1985-12-01), Fryd
Esch et al, "Rheology Control of Films Deposited by Spin Coating Techniques", IBM TDB vol. 16, No. 6, Nov. 1973.

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