Method of providing a metal layer on a substrate

Details Method of providing a metal layer on a substrate Method of providing a metal layer on a substrate

1983-12-05

1985-06-04

Lawrence, Evan K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427167, 427250, 4272556, 4272557, B05D 306

Patent

active

045214441

ABSTRACT:
A method of providing a metal layer on a substrate having an ultra-smooth or microprofiled surface, in which the surface structure is reproduced in the metal layer. On the substrate surface which is hydrophilic or is made hydrophilic, preferably a monomolecular layer of alkoxysilylalkylthiol, an alkoxysilylalkylamine or a chlorosilylalkylthiol is provided as a bonding intermediary in a layer which is at most 15 molecules thick by contact with an atmosphere in which said substance is present in a vapor form. The metal layer is vapor-deposited thereon in a thickness of 50-300 nm.

REFERENCES:
patent: 4315970 (1982-02-01), McGee

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