Method of providing a low cost semiconductor transmitter...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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Details

C398S091000, C372S026000, C372S032000

Reexamination Certificate

active

07010185

ABSTRACT:
A method of deploying a passive optical combiner that is a broad bandwidth spectral wavelength combiner for combining the outputs from multiples transmitter photonic integrated circuit (TxPIC) chips and, thereafter, the amplification of the combined channel signals with a booster optical amplifier couple between the passive optical combiner and the fiber transmission link. The booster optical amplifier may be a rear earth fiber amplifier, such as an erbium doped fiber amplifier (EDFA), or one or more semiconductor optical amplifiers (SOAs) on one or more semiconductor chips. Such a combination of optical components simplifies the design of individual TxPICs and other such optical communication PICs, which has to take into consideration the nonlinear effects of difficult, high loss single mode fiber (SMF) links or other fiber-type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted directly on the TxPIC chip through the deployment of on-chip optical amplifiers, such as semiconductor optical amplifiers (SOAs), integrated in locations following the electro-optic (EO) modulators, if not integrated also at other locations on the same chip.

REFERENCES:
patent: 5394489 (1995-02-01), Koch
patent: 5745613 (1998-04-01), Fukuchi et al.
patent: 5960141 (1999-09-01), Sasaki et al.
patent: 5987050 (1999-11-01), Doerr et al.
patent: 6192170 (2001-02-01), Komatsu
patent: 6236771 (2001-05-01), Aoki et al.
patent: 6271947 (2001-08-01), Iannone et al.
patent: 6275317 (2001-08-01), Doerr et al.
patent: 6542268 (2003-04-01), Rotolo et al.
patent: 6700517 (2004-03-01), Kellar
patent: 0636908 (1995-02-01), None
M. G. Young et al., “A 16×1 WDM Transmitter with Integrated DBR Lasers and Electroabsorption Modulators”,Integrated Photonics Research, Washington, D.C., vol. 10, pp. 414-417, Mar. 22-24, 1993, Palm Springs, CA, US.
E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”,IEEE/CPMT Electronic Packing Technology Conference, 1997, Proceedings of 1997 Conference, pp. 18-28, 1STSingapore, Oct. 8-10, 1997, and IEEE in 1997, New York, NY, US.
U. Koren et al., “Photonic Integrated Circuits for Telecommunication—Present Status and Future Trends—”,Japanese Journal of Applied Physics, Extended Abstracts 22NDConference on Solid State Devices and Materials, pp. 773-775, 1990, Tokyo, JP.
Minoru Maeda et al., “Photonic Integrated Circuit Combining two GaAs Distributed Bragg Reflector laser Diodes for Generation of the Beat Signal”,Japanese Journal of Applied Physics, vol. 31(2B), pp. L183-L185, Feb. 15, 1992, Tokyo, JP.
Koji Kudo et al., “1.55-mm Wavelength-Selectable Microarray DFB-LD's with Integrated MMI Combiner, SOA, and EA-Modulator”,Optical Fiber Conference(OFC), Technical Digest Post Conference Addition, vol. 1 of 4, pp. 190-192, Mar. 7-10, 2000, Baltimore, MD, US.

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