Method of providing a hydrophobic layer and condenser...

Details Method of providing a hydrophobic layer and condenser... Method of providing a hydrophobic layer and condenser...

2006-08-10

2009-06-23

Ensey, Brian (Department: 2615)

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

Microphone capsule only

C381S175000, C381S191000

Reissue Patent

active

RE040781

ABSTRACT:
A method of providing at least part of a diaphragm and at least a part of a back-plate of a condenser microphone with a hydrophobic layer so as to avoid stiction between said diaphragm and said back-plate. The layer is deposited via a number small of openings in the back-plate, the diaphragm and/or between the diaphragm and the back-plate. Provides a homogeneous and structured hydrophobic layer, even to small internal cavities of the microstructure. The layer may be deposited by a liquid phase or a vapor phase deposition method. The method may be applied naturally in continuation of the normal manufacturing process.Further, a MEMS condenser microphone is provided having such a hydrophobic layer. The static distance between the diaphragm and the back-plate of the microphone is smaller than 10 μm.

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