Method of providing a copper pattern on a dielectric substrate

Details Method of providing a copper pattern on a dielectric substrate Method of providing a copper pattern on a dielectric substrate

1992-07-01

1993-09-21

Owens, Terry J.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427301, 427307, 156662, C23C 2600

Patent

active

052467325

ABSTRACT:
The adhesion of electroless copper to a substrate (1) for a conductor pattern can be improved by applying a SiO.sub.2 layer (3) on which a thin metal pattern of, for example, TiW (51) is provided. Anchors are formed on the surface by subjecting the SiO.sub.2 layer to an underetching treatment. The electroless copper (9) grows around these anchors and, hence, adheres to the substrate.

REFERENCES:
patent: 3485665 (1969-12-01), De Angelo
patent: 4328080 (1982-05-01), Harris
patent: 4946709 (1990-08-01), Takada

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