Method of protecting the surface of foil and other thin sheet ma

Details Method of protecting the surface of foil and other thin sheet ma Method of protecting the surface of foil and other thin sheet ma

1997-07-25

1999-11-23

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156247, 156288, 156289, 156323, 118 45, 118620, 428209, 428352, 428355R, 428901, B44C 1165, B32B 3100, B32B 300, B65C 925

Patent

active

059893770

ABSTRACT:
A method for protecting a substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards involving applying a lamination mold-release layer to one side of a protective film, and applying a preferably electron beam curable adhesive pressure-sensitive coating to the other side of the film, curing the adhesive coating, and laminating the protective film to the foil or other substrate sheet, which, in turn, may be laminated to other substrates such as dielectric sheets.
The laminate product is a protected substrate sheet having a protective film laminated to one side of the sheet (or both), the film having a lamination mold-release layer on one side thereof and an electron beam cured pressure-sensitive adhesive coating on the other side thereof, said other side contacting but being releasably detachable from said substrate sheet
Where the substrate sheet is a foil or similar surface, protection is thus provided during handling and storage as well as during lamination, and the protective film is peelably detachable from the foil.

REFERENCES:
patent: 4753847 (1988-06-01), Wilheim et al.
patent: 4875283 (1989-10-01), Johnson
patent: 5120590 (1992-06-01), Savage et al.
patent: 5167997 (1992-12-01), Chamberlain et al.
patent: 5725937 (1998-03-01), Johnson

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