Method of protecting micromechanical devices during wafer separa

Details Method of protecting micromechanical devices during wafer separa Method of protecting micromechanical devices during wafer separa

1995-05-23

1997-02-25

Little, Willis

Abrading

Abrading process

451 41, 451 54, 451 57, 451388, 269 21, 437226, 148DIG28, B24B 4106

Patent

active

056054890

ABSTRACT:
A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

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