Method of protecting device leads of a packaged integrated circu

Details Method of protecting device leads of a packaged integrated circu Method of protecting device leads of a packaged integrated circu

1997-10-10

1999-11-02

Chaudhuri, Olik

Semiconductor device manufacturing: process

Repair or restoration

438 15, 294261, 294264, 29762, H01L 2166

Patent

active

059768975

ABSTRACT:
Device leads on a packaged integrated circuit are protected during a decapsulation process. A composite material such as wax is applied to coat the leads. At least a portion of a package containing the integrated circuit is then removed while the composite material is coating the leads, the coated leads being protected from fumes associated with the decapsulation process and less susceptible to deformation during handling. The composite material is then removed from the leads after the portion of the package is removed from the packaged device.

REFERENCES:
patent: 4089704 (1978-05-01), Heiss et al.
patent: 5367762 (1994-11-01), Disko et al.
patent: 5424254 (1995-06-01), Damiot
patent: 5477099 (1995-12-01), Brendeck et al.

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