Method of protecting bumped semiconductor chips

Details Method of protecting bumped semiconductor chips Method of protecting bumped semiconductor chips

1977-12-29

1979-10-30

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 82, 427 88, 427 93, 427240, 427264, 427270, 427277, 427379, B05D 512, H01L 2188

Patent

active

041729072

ABSTRACT:
A method of protecting from physical damage the upper surface of medium and large scale integrated IC circuit chips. Certain types of IC chips are provided with a plurality of input/output terminals, or bumps, which project above the upper surface of the chips on which they are formed. The upper surface of each such chip, including its bumps, are spin coated with a thin adhesion promoter which is then dried. The chips and its terminals are next spin coated with a layer of a heat curable resin which is partially cured. The resin and the adhesion promoter are then removed from the upper surfaces of the bump by rubbing with a soft abrasive material. The resin remaining on each IC chip is then finally cured.

REFERENCES:
patent: 3165430 (1965-01-01), Hugle
patent: 3549398 (1970-12-01), Watson
patent: 3663277 (1972-05-01), Koepp
patent: 3730751 (1973-05-01), Newberger
patent: 3978578 (1976-09-01), Murphy
patent: 4017340 (1977-04-01), Yerman
patent: 4115602 (1978-09-01), Bullard

Affiliated with

Also associated with

Rating

Method of protecting bumped semiconductor chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of protecting bumped semiconductor chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of protecting bumped semiconductor chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-20365