Method of profiling the termination paste for chip capacitor ele

Details Method of profiling the termination paste for chip capacitor ele Method of profiling the termination paste for chip capacitor ele

1997-10-17

1999-04-13

Talbot, Brian K.

Coating processes

Electrical product produced

Condenser or capacitor

427284, 4274301, 29874, 29885, 29 2542, 22818021, B05D 512

Patent

active

058940332

ABSTRACT:
A method of profiling the border of termination paste applied to a chip capacitor electrode comprising the steps of casting a layer of termination paste of finite thickness; passing a profiling element through the upper part of the layer of paste, the element having an exterior profile that is arranged to dip into the paste and scrape some of the paste from the upper part of the paste layer to form a reverse profile in the layer of the paste; and, dipping a chip capacitor electrode into the paste layer at the reverse profile formed therein, to terminate the capacitor with the profile formed in the paste.

REFERENCES:
patent: 4310566 (1982-01-01), McGrath
patent: 4393808 (1983-07-01), Braden
patent: 4664943 (1987-05-01), Nitta et al.
patent: 5296262 (1994-03-01), Didden

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