Method of production of peeling layer paste and method of...

Details Method of production of peeling layer paste and method of... Method of production of peeling layer paste and method of...

2008-07-08

2008-07-08

Mayes, Melvin C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089160, C156S289000, C501S001000, C501S094000

Reexamination Certificate

active

07396425

ABSTRACT:
A method of production of peeling layer paste used for producing a multilayer electronic device, having a step of preparing a primary slurry containing a ceramic powder having an average particle size of 0.1 pm or less, a binder, and a dispersion agent and having a nonvolatile concentration of 30 wt % or more, a step of adding to the primary slurry a binder-lacquer solution to dilute the primary slurry to prepare a secondary slurry having a nonvolatile concentration of 15 wt % or less and a content of the binder of 12 parts by weight or more with respect to 100 parts by weight of the ceramic powder, and a high pressure dispersion treatment step of running the secondary slurry through a wet jet mill to apply to the secondary slurry a shear rate of 1.5×106to 1.3×107(1/s).

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