Method of producing wire-bonded substrate assembly

Details Method of producing wire-bonded substrate assembly Method of producing wire-bonded substrate assembly

1991-11-22

1994-08-16

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 269901, 439 84, H05K 334

Patent

active

053374673

ABSTRACT:
A wire-bonded substrate assembly is made up of a substrate having a first surface and a second surface which is opposite to the first surface, and a plurality of elements mounted on the first and second surfaces of the substrate. The elements at least include resin encapsulated integrated circuit chips which are wire-bonded and encapsulated by a synthetic resin. A first one of the resin encapsulated integrated circuit chips is mounted at a first region on the first surface of the substrate, while a second one of the resin encapsulated integrated circuit chips is mounted at a second region on the second surface of the substrate. The second region is other than a region on the second surface opposite to the first region on the first surface.

REFERENCES:
patent: 4187751 (1980-02-01), Barnacle
patent: 4640010 (1987-02-01), Brown
patent: 4841633 (1989-06-01), Kinugawa
patent: 5054193 (1991-10-01), Ohms et al.
patent: 5144535 (1992-09-01), Megens et al.
patent: 5155904 (1992-10-01), Majd

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