Method of producing wafer

Details Method of producing wafer Method of producing wafer

1986-10-10

1988-07-12

Schor, Kenneth M.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Surface finishing

156662, 29DIG15, 51283R, 51 5C, 65 61, 65 70, 437225, C03B 946

Patent

active

047567961

ABSTRACT:
There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by the first flat surface and a cut surface subjected to the cutting; and processing the cut surface of the slice to form a second flat surface, using the first flat surface as a reference surface, thereby providing the wafer.

REFERENCES:
patent: 2886026 (1959-05-01), Stewart
patent: 4084354 (1978-04-01), Grandia et al.
patent: 4228578 (1980-10-01), Lin et al.
patent: 4261781 (1981-04-01), Edmonds et al.
patent: 4276114 (1981-06-01), Takano et al.
patent: 4465550 (1984-08-01), Lane
patent: 4554717 (1985-11-01), Vig et al.
The American Heritage Dictionary, Houghton Mifflin Co. Boston 2nd College ed. 1976, pp. 406 & 1359.
European Search Report EP 86 11 4697 10-02-87 Bracke P.P. J.L.

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