Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Patent
1991-04-15
1993-08-10
Walsh, Donald P.
Specialized metallurgical processes, compositions for use therei
Compositions
Consolidated metal powder compositions
75235, 419 19, 419 23, 419 39, 419 49, 420430, C22C 2704, B22F 100
Patent
active
052344878
ABSTRACT:
Tungsten-titanium sputter targets of at least 95% theoretical density are provided with little or no .beta.(Ti, W) phase constituent. Such targets will minimize troublesome particulate emissions during sputter coating conditions.
REFERENCES:
patent: 3356495 (1967-12-01), Zima et al.
patent: 3356496 (1967-12-01), Hailey
patent: 3689259 (1972-09-01), Hailey
patent: 3729971 (1973-05-01), Gurganus et al.
patent: 4219357 (1980-08-01), Yolton et al.
patent: 4331476 (1982-05-01), Helderman et al.
patent: 4381942 (1983-05-01), Blum et al.
patent: 4428856 (1984-01-01), Boyarina et al.
patent: 4564501 (1986-01-01), Goldstein
patent: 4619695 (1986-10-01), Oikawa et al.
patent: 4663120 (1987-05-01), Parent et al.
patent: 4673549 (1987-06-01), Ecev
patent: 4714587 (1987-12-01), Eylon et al.
patent: 4731116 (1988-03-01), Kay
patent: 4746363 (1988-05-01), DeAngelis
patent: 4750932 (1988-06-01), Parent et al.
patent: 4770948 (1988-09-01), Oikawa et al.
patent: 4838935 (1989-06-01), Dunlop et al.
patent: 4931253 (1990-06-01), Eylon et al.
patent: 4966626 (1990-10-01), Fujiki et al.
T. Brat et al., Proceedings 2nd ASM Int'l Elect. Materials & Processing Congress, Phila., Pa., Apr. 89, pp. 241-248.
E. Waterman et al, Proceedings of 7th IEEE VLSI Multilevel Interconnection Conf., Santa Clara, Calif., Jun. 90, pp. 329-331.
Massalski, Binary Alloy Phase Diagrams, vol. 2, ASM Int'l, Metals Park, Ohio, pp. 2136-2137.
L. V. Pavlinov, Fiz. Metal. i Metalloved. 24, 272 (1967).
Michael Hill, Magnetron Sputtered Titanium-Tungsten Films, Solid State Tech., Jan. 1980, pp. 53-59.
Rudy et al, Revision of the Titanium-Tungsten System, Trans. of the Metal. Soc. of AIME, vol. 242, May 68, pp. 953-954.
Yamauchi et al, Development of W-Ti Binary Alloy Sputtering Target and Study of its Sputtering Characteristics, Nippon Tungsten Review, vol. 22 (2989), pp. 55-72.
Mueller John J.
Wickersham, Jr. Charles E.
Mai Ngoclan T.
Tosoh SMD, Inc.
Walsh Donald P.
LandOfFree
Method of producing tungsten-titanium sputter targets and target does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing tungsten-titanium sputter targets and target, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing tungsten-titanium sputter targets and target will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1722374