Method of producing treated copper foil, products thereof and el

Details Method of producing treated copper foil, products thereof and el Method of producing treated copper foil, products thereof and el

1991-01-16

1993-05-04

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly single metal or alloy substrate of...

205240, C25D 358, C25D 706

Patent

active

052078892

ABSTRACT:
An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards.

REFERENCES:
patent: 3857681 (1974-12-01), Yates et al.
patent: 4572768 (1986-02-01), Wolski et al.

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