Method of producing thin semiconductor structures

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure

Reexamination Certificate

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Details

C257S081000, C257S090000, C257S099000, C257S103000, C257S192000, C438S022000, C438S028000, C438S033000, C438S046000

Reexamination Certificate

active

07985971

ABSTRACT:
A method of making a thin gallium-nitride (GaN)-based semiconductor structure is provided. According to one embodiment of the invention, the method includes the steps of providing a substrate; sequentially forming one or more semiconductor layers on the substrate; etching a pattern in the one or more semiconductor layers; depositing a dielectrics layer; forming a photoresist on a portion of the dielectrics layer, wherein the portion of the dielectrics layer is deposited on the one or more semiconductor layers; depositing a primer; removing the photoresist layer, wherein the primer on the photoresist is also removed; depositing a superhard material, wherein the superhard material forms in the pattern; and removing the substrate. Accordingly, the superhard material may be selectively deposited in only areas where the superhard material is desired. Vertical GaN-based light emitting devices may then be formed by cutting the semiconductor structure.

REFERENCES:
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patent: 7125741 (2006-10-01), Yen et al.
patent: 2005/0009345 (2005-01-01), Yen et al.
patent: 2007/0126022 (2007-06-01), Baik et al.
patent: 2009/0039383 (2009-02-01), Chu et al.
patent: 1510765 (2004-07-01), None
patent: 2007158334 (2007-06-01), None
patent: WO-2009/021416 (2009-02-01), None
International Search Report issued Jan. 7, 2010 in related Application No. PCT/CN2009/071047.

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