Method of producing thin film magnetic head

Details Method of producing thin film magnetic head Method of producing thin film magnetic head

2007-08-27

2010-11-09

Tran, Binh X (Department: 1713)

Etching a substrate: processes

Gas phase etching of substrate

C216S022000, C438S003000, C438S689000

Reexamination Certificate

active

07828985

ABSTRACT:
A method of producing a thin film magnetic head includes the steps of: forming a second lower magnetic pole layer in a part on a first lower magnetic pole layer; forming, over the entire wafer surface, an insulating layer so as to be thicker than the thickness of the second lower magnetic pole layer in the stacking direction, the insulating layer being less likely to be etched than the second lower magnetic pole layer; carrying out a planarizing process by CMP on the entire wafer surface until the second lower magnetic pole layer is exposed; forming a concave portion including the second lower magnetic pole layer and the insulating layer by ion beam etching on the entire wafer surface; forming a recording gap layer over the entire wafer surface; and forming a first upper magnetic pole layer in the upper magnetic pole layer so as to fill the concave portion.

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