Method of producing surface package type semiconductor package

Details Method of producing surface package type semiconductor package Method of producing surface package type semiconductor package

1992-07-20

1994-01-04

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

29859, H05K 506

Patent

active

052749142

ABSTRACT:
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging.
To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

REFERENCES:
patent: 2674509 (1954-04-01), Barnet
patent: 3454154 (1969-07-01), Peters et al.
patent: 3704806 (1972-12-01), Plachenov et al.
patent: 3909504 (1975-09-01), Browne
patent: 4026008 (1977-05-01), Drees et al.
patent: 4156751 (1979-05-01), Yenni et al.
patent: 4496406 (1985-01-01), Dedow
patent: 4695926 (1987-09-01), McDermott

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